Thixotropic Premium Thermal Compound (NOTE: This product has been discontinued)


Matrix Thixotropic Premium Thermal Compound offers optimum performance in demanding moderate to large bond line situations. It is designed for a wide range of applications between modern high-power CPUs and GPUs and high-performance heatsinks or water-cooling solutions.

Features:

Thermal Matrix:
The unique blend of micronized Zinc Oxide, Aluminum Oxide, and Aluminum particles in silicone base oil forms a thermally conductive matrix that provides class-leading performance and exceptional long-term stability.

Performance Attributes:
Matrix’s silicone suspension fluid and conductive fillers are engineered for easy application and superior surface wetting. This enhances performance in moderate bond line applications and offers better performance than other Arctic Silver retail market thermal compounds in large bond line situations. During initial use, Matrix wets the thermal surfaces and fills the microscopic voids and valleys. With time, pressure, heat and vibration, Matrix achieves superior thermal contact between the surfaces.

Electrical Insulator:
Matrix is not electrically conductive.

Performance:
2 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.

Innovative Dispenser: 
The amount of compound remaining in the 2.5-gram syringe is easy to determine as the rear of the plunger is perfectly flush with the flange when the syringe is empty.

Compliancy: RoHS Compliant.

Specifications:

Average Particle Size: 7.8 micron 0.00031 inch

Temperature Limits: Peak: –50°C to 135°C

Coverage Area: 2.5-gram syringe. (About 1cc) At a layer 0.003" thick, one syringe will cover about 20 square inches.

Important Reminder:
Due to the unique carrier fluid used and the shapes and sizes of the thermally conductive particles in Matrix, it will take a minimum of 300 hours and multiple thermal cycles to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will often drop significantly over this "break-in" period. This break-in will occur during the normal use of the computer as long as the computer is turned off from time to time and the interface is allowed to cool to room temperature. Once the break-in is complete, the computer can be left on if desired.